| Parameter | 사양 |
|------------|---------------|
| 외관 | 백색 결정성 분말 |
| 순도(HPLC) | **≥99.5%** |
| 녹는점 | 245.0–248.0 °C |
| Water Content | ≤0.20% |
| Phenol | ≤0.20% |
| 4-HAP | ≤0.20% |
| Color (APHA) | ≤150 |
| Iron | **≤5 ppm** |
| Quality Parameter | Why It Matters |
| **≥99.5% purity (HPLC)** | Minimizes side reactions; ensures consistent resin performance |
| **Iron ≤5 ppm** | Prevents metal contamination that can compromise semiconductor device reliability |
| **Phenol & 4-HAP ≤0.20%** | Controls reactive impurities for reproducible polymerization |
| **Water ≤0.20%** | Prevents hydrolysis and ensures stable processing |
| **Color (APHA) ≤150** | Maintains optical clarity for photoresist and transparent applications |
| 신청 | Key Property | Proven Performance |
| Deep-UV photoresist | Sensitivity & resolution | 3 mJ/cm², sub-40 nm, 8.2–8.4 nm LER |
| Blow-molding polycarbonate | Melt shear sensitivity | Viscosity ratio 8.0–10.0 at 275 °C |
| Aerospace composites | Thermal stability & modulus | Tg >380 °C, 3.7 GPa |
| Epoxy toughening | Impact strength | 247.4% improvement at 12 wt% loading |
## 결론
